ProductsManufacturers
Events
Send an RFQBOM Tool

70T9169L7BFI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 70T9169L7BFI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    1
  • JESD-30 Code
    S-PBGA-B100
  • Memory Width
    9
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • Memory Organization
    16KX9
  • Number of Functions
    1
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    7
  • Number of Words Code
    16K
  • Memory Density (bits)
    147456
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.5
  • Supply Voltage-Max (V)
    2.6
  • Supply Voltage-Min (V)
    2.4
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    16384
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for 70T9169L7BFI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
70T9169L7BFI
Send an RFQ
70T9169L7BFI