70T3339S133BFGI8 by Renesas Electronics Corp. | Sourcengine

Renesas Electronics Corp. 70T3339S133BFGI8

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA208
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
15
Length (mm)
15
JESD-30 Code
S-PBGA-B208
Memory Width
18
Package Code
TFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Memory Organization
512KX18
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
15
Number of Words Code
512K
Memory Density (bits)
9437184
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
2.6
Supply Voltage-Min (V)
2.4
Supply Voltage-Nom (V)
2.5
Number of Words (words)
524288
Standby Current-Max (A)
0.015
Standby Voltage-Min (V)
2.4
Supply Current-Max (mA)
450
Package Equivalence Code
BGA208,17X17,32
Clock Frequency-Max (MHz)
133
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30