ProductsManufacturers
Events
Send an RFQBOM Tool

70T16L25BFI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 70T16L25BFI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    10 mm
  • Length
    10 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B100
  • Memory Width
    9
  • Organization
    16KX9
  • Package Code
    LFBGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    147456 bit
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    25 ns
  • Number of Ports
    2
  • Number of Words
    16384 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Seated Height-Max
    1.4 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    160 mA
  • Number of Functions
    1
  • Number of Terminals
    100
  • Standby Current-Max
    0.005 Amp
  • Standby Voltage-Min
    2.4 V
  • Number of Words Code
    16K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA100,10X10,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    2.6 V
  • Supply Voltage-Min (Vsup)
    2.4 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    20

0 suppliers available to buy or to bid for 70T16L25BFI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
70T16L25BFI
Send an RFQ
70T16L25BFI