70P34L25BF by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 70P34L25BF

Lifecycle status
Transferred
Description
CABGA 10.00x10.00x1.40 mm 0.80mm Pitch
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
10
Length (mm)
1
JESD-30 Code
S-PBGA-B100
Memory Width
18
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn63Pb37)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Memory Organization
4KX18
Number of Functions
1
Number of Terminals
100
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
25
Number of Words Code
4K
Memory Density (bits)
73728
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
4096
Standby Current-Max (A)
0.005
Standby Voltage-Min (V)
1.7
Supply Current-Max (mA)
32
Package Equivalence Code
BGA100,10X10,32
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20