7099S25PF9
Integrated Device Technology, Inc.
- Lifecycle statusTransferred
- REACHREACH compliant
- DescriptionTQFP 14.00x14.00x1.40 mm 0.65mm Pitch
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.41
- SB Code8542.32.00.40
- Width14 mm
- Length14 mm
- TechnologyBICMOS
- JESD-30 CodeS-PQFP-G80
- Memory Width9
- Organization4KX9
- Package CodeHLQFP
- JESD-609 Codee0
- Package ShapeSQUARE
- Package StyleFLATPACK, HEAT SINK/SLUG, LOW PROFILE Meter
- Surface MountYES
- Terminal FormGULL WING
- Memory Density36864 bit
- Memory IC TypeMULTI-PORT SRAM
- Operating ModeSYNCHRONOUS
- Terminal Pitch0.65 mm
- Access Time-Max25 ns
- Number of Words4096 words
- Parallel/SerialPARALLEL
- Terminal FinishTIN LEAD
- Seated Height-Max1.6 mm
- Temperature GradeCOMMERCIAL
- Terminal PositionQUAD
- Additional FeatureAUTOMATIC POWER-DOWN
- Number of Functions1
- Number of Terminals80
- Number of Words Code4K
- Package Body MaterialPLASTIC/EPOXY
- Operating Temperature-Max70 Cel
- Operating Temperature-Min0 Cel
- Supply Voltage-Max (Vsup)5.5 V
- Supply Voltage-Min (Vsup)4.5 V
- Supply Voltage-Nom (Vsup)5 V
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)240
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7099S25PF9