709359L7BF by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 709359L7BF

Lifecycle status
Transferred
Description
CABGA 10.00x10.00x1.40 mm 0.80mm Pitch
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Width
10 mm
Length
10 mm
I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B100
Memory Width
18
Organization
8KX18
Package Code
LFBGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
147456 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Access Time-Max
18 ns
Number of Ports
2
Number of Words
8192 words
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn63Pb37)
Seated Height-Max
1.5 mm
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Supply Current-Max
400 mA
Number of Functions
1
Number of Terminals
100
Standby Current-Max
0.003 Amp
Standby Voltage-Min
4.5 V
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
BGA100,10X10,32
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20