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70824S45GB

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 70824S45GB
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    S-CBGA-P84
  • Memory Width
    16
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Memory Organization
    4KX16
  • Number of Functions
    1
  • Number of Terminals
    84
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    45
  • Number of Words Code
    4K
  • Memory Density (bits)
    65536
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    4096
  • Standby Current-Max (A)
    0.03
  • Supply Current-Max (mA)
    400
  • Package Equivalence Code
    PGA84M,11X11
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-PRF-38535

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70824S45GB
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70824S45GB