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7052S25PQFGM

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 7052S25PQFGM
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G132
  • Memory Width
    8
  • Package Code
    BQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    APPLICATION SPECIFIC SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    4
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    2KX8
  • Number of Terminals
    132
  • Terminal Pitch (mm)
    0.635
  • Access Time-Max (ns)
    25
  • Number of Words Code
    2K
  • Memory Density (bits)
    16384
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2048
  • Standby Current-Max (A)
    0.03
  • Standby Voltage-Min (V)
    4.5
  • Supply Current-Max (mA)
    360
  • Package Equivalence Code
    SPQFP132,1.1SQ
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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7052S25PQFGM