7007L25PF8 by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 7007L25PF8

Lifecycle status
Transferred
Description
TQFP 14.00x14.00x1.40 mm 0.65mm Pitch
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
14
Length (mm)
14
JESD-30 Code
S-PQFP-G80
Memory Width
8
Package Code
LQFP
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Memory Organization
32KX8
Number of Functions
1
Number of Terminals
80
Terminal Pitch (mm)
0.65
Access Time-Max (ns)
25
Number of Words Code
32K
Memory Density (bits)
262144
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
32768
Standby Current-Max (A)
0.005
Standby Voltage-Min (V)
4.5
Supply Current-Max (mA)
265
Package Equivalence Code
QFP80,.64SQ
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20