MAXWELL TECHNOLOGIES, INC. 69F1608RPFI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    20.828
  • Length (mm)
    28.956
  • Data Polling
    NO
  • JESD-30 Code
    R-XDFP-F24
  • Memory Width
    8
  • Package Code
    GDFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, GUARD RING Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    512
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Memory Organization
    16MX8
  • Number of Functions
    1
  • Number of Terminals
    24
  • Sector Size (words)
    8K
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    35
  • Number of Words Code
    16M
  • Memory Density (bits)
    134217728
  • Package Body Material
    UNSPECIFIED
  • Number of Sectors/Size
    2K
  • Seated Height-Max (mm)
    8.5344
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    16777216
  • Programming Voltage (V)
    5
  • Standby Current-Max (A)
    0.0004
  • Supply Current-Max (mA)
    40
  • Package Equivalence Code
    FL24,1.1
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

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69F1608RPFI