ProductsManufacturers
Events
Send an RFQBOM Tool

68681/BUA

PHILIPS COMPONENTS

PHILIPS COMPONENTS 68681/BUA
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    MOS
  • JESD-30 Code
    S-CQCC-N44
  • Package Code
    QCCN
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Low Power Mode
    NO
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Terminals
    44
  • Number of Serial I/Os
    2
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Communication Standard
    ASYNC, BIT; BISYNC
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Clock Frequency-Max (MHz)
    4
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER)
  • Data Transfer Rate-Max (MBps)
    1
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for 68681/BUA

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
68681/BUA
Send an RFQ
68681/BUA