Intel Corporation 5ASXMB5E4F31I3G
  • ECCN
    3A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    31 mm
  • Length
    31 mm
  • Technology
    TSMC
  • JESD-30 Code
    S-PBGA-B896
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    1 mm
  • Seated Height-Max
    2.7 mm
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    1.18 V
  • Supply Voltage-Min
    1.12 V
  • Supply Voltage-Nom
    1.15 V
  • Number of Terminals
    896
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA896,30X30,40
  • Operating Temperature-Max
    100 Cel
  • Operating Temperature-Min
    -40 Cel
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC

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5ASXMB5E4F31I3G