5AGXBA3H6F27I3N

Intel Corporation

Intel Corporation 5AGXBA3H6F27I3N
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    28 nm
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B672
  • Organization
    5890 CLBS
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    5890
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of Inputs
    416
  • Number of Outputs
    416
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    672
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    156000
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.7
  • Supply Voltage-Max (V)
    1.18
  • Supply Voltage-Min (V)
    1.12
  • Supply Voltage-Nom (V)
    1.15
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA672,26X26,40
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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