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5962R9570801TXX

Intersil Corporation

Intersil Corporation 5962R9570801TXX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    9.905 mm
  • Technology
    CMOS
  • Total Dose
    100k Rad(Si) V
  • JESD-30 Code
    R-CDFP-F24
  • Memory Width
    8
  • Organization
    2KX8
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    16384 bit
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    100 ns
  • Number of Words
    2048 words
  • Parallel/Serial
    PARALLEL
  • Screening Level
    MIL-PRF-38535 Class T
  • Seated Height-Max
    2.92 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    24
  • Number of Words Code
    2K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel

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5962R9570801TXX