AEROFLEX MICROELECTRONIC SOLUTIONS 5962R0822801QXC
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Total Dose
    100k Rad(Si) V
  • Speed (MHz)
    66
  • JESD-30 Code
    S-CQFP-F352
  • Package Code
    GQFF
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, GUARD RING Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    352
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    TPAK352,2.9SQ,20
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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