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5962H9658001QEC

AEROFLEX MICROELECTRONIC SOLUTIONS

AEROFLEX MICROELECTRONIC SOLUTIONS 5962H9658001QEC
  • ECCN
    3A001.a.1.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Total Dose
    1M Rad(Si) V
  • JESD-30 Code
    R-XDIP-T16
  • Package Code
    DIP
  • Logic IC Type
    R-S LATCH
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Number of Bits
    1
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    4
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Load Capacitance (pF)
    50
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    DIP16,.3
  • Output Low Current-Max (mA)
    12
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Propagation Delay-Max@Nom-Sup (ns)
    18
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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5962H9658001QEC