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5962H9312801VYX

BAE SYSTEMS PLC

BAE SYSTEMS PLC 5962H9312801VYX
  • ECCN
    3A001.a.1.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Total Dose
    1M Rad(Si) V
  • Width (mm)
    16.51
  • Length (mm)
    19.68
  • JESD-30 Code
    R-XDFP-F40
  • Memory Width
    1
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    256KX1
  • Number of Functions
    1
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    0.64
  • Access Time-Max (ns)
    60
  • Number of Words Code
    256K
  • Memory Density (bits)
    262144
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1.98
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-PRF-38535 Class V

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5962H9312801VYX