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5962G9651903VXC

AEROFLEX MICROELECTRONIC SOLUTIONS

AEROFLEX MICROELECTRONIC SOLUTIONS 5962G9651903VXC
  • ECCN
    3A001.a.1.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Total Dose
    500k Rad(Si) V
  • JESD-30 Code
    R-XDFP-F14
  • Package Code
    DFP
  • Logic IC Type
    AND GATE
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Schmitt Trigger
    NO
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    14
  • Terminal Pitch (mm)
    1.27
  • Load Capacitance (pF)
    50
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    FL14,.3
  • Output Low Current-Max (mA)
    6
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Propagation Delay-Max@Nom-Sup (ns)
    17
  • Screening Level / Reference Standard
    38535V;38534K;883S

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5962G9651903VXC