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5962G9651901Q9A

AEROFLEX MICROELECTRONIC SOLUTIONS

AEROFLEX MICROELECTRONIC SOLUTIONS 5962G9651901Q9A
  • ECCN
    3A001.a.1.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Total Dose
    500k Rad(Si) V
  • JESD-30 Code
    R-XUUC-N14
  • Package Code
    DIE
  • Logic IC Type
    AND GATE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Schmitt Trigger
    NO
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    UPPER
  • Number of Terminals
    14
  • Load Capacitance (pF)
    50
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    DIE OR CHIP
  • Output Low Current-Max (mA)
    8
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Propagation Delay-Max@Nom-Sup (ns)
    13
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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5962G9651901Q9A