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5962-9679603HXC

Microsemi Corporation

Microsemi Corporation 5962-9679603HXC
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    11.23
  • JESD-30 Code
    R-CDSO-J32
  • Memory Width
    8
  • Package Code
    SOJ
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e4
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    GOLD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Access Time-Max (ns)
    200
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Programming Voltage (V)
    5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Write Cycle Time-Max (tWC) (ms)
    10
  • Screening Level / Reference Standard
    MIL-STD-883

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5962-9679603HXC
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5962-9679603HXC