5962-9561701MPA
Xilinx,Inc.
- Lifecycle statusDiscontinued
- DescriptionConfiguration Memory, 256KX1, Serial, CMOS, CDIP8
- Category
- ECCN3A001.A.2.C
- ECCN GovernanceEAR
- HTS Code8542.32.00.51
- SB Code8542.32.00.50
- Width7.62 mm
- Length10.16 mm
- I/O TypeCOMMON
- TechnologyCMOS
- JESD-30 CodeR-GDIP-T8
- Memory Width1
- Organization256KX1
- Package CodeDIP
- JESD-609 Codee0
- Package ShapeRECTANGULAR
- Package StyleIN-LINE Meter
- Surface MountNO
- Terminal FormTHROUGH-HOLE
- Memory Density262144 bit
- Memory IC TypeCONFIGURATION MEMORY
- Operating ModeSYNCHRONOUS
- Terminal Pitch2.54 mm
- Number of Words262144 words
- Parallel/SerialSERIAL
- Screening LevelMIL-STD-883
- Terminal FinishTIN LEAD
- Seated Height-Max5.08 mm
- Temperature GradeMILITARY
- Terminal PositionDUAL
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- Supply Current-Max10 mA
- Number of Functions1
- Number of Terminals8
- Standby Current-Max5.0E-5 Amp
- Number of Words Code256K
- Qualification StatusNot Qualified
- Package Body MaterialCERAMIC, GLASS-SEALED
- Output Characteristics3-STATE
- Package Equivalence CodeDIP8,.3
- Operating Temperature-Max125 Cel
- Operating Temperature-Min-55 Cel
- Supply Voltage-Max (Vsup)5.5 V
- Supply Voltage-Min (Vsup)4.5 V
- Supply Voltage-Nom (Vsup)5 V
- Clock Frequency-Max (fCLK)12.5 MHz
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5962-9561701MPA