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5962-8873504LA

WAFERSCALE INTEGRATION INC

WAFERSCALE INTEGRATION INC 5962-8873504LA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    7.62
  • Length (mm)
    31.877
  • JESD-30 Code
    R-GDIP-T24
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    1KX1
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    25
  • Number of Words Code
    1K
  • Memory Density (bits)
    1024
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Max (V)
    6
  • Supply Voltage-Min (V)
    2.8
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    2048
  • Supply Current-Max (mA)
    120
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883

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5962-8873504LA
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5962-8873504LA