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5962-8871502PA

Microsemi Corporation

Microsemi Corporation 5962-8871502PA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BIPOLAR
  • JESD-30 Code
    R-GDIP-T8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb) - hot dipped
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    BUFFER OR INVERTER BASED PERIPHERAL DRIVER
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Driver Number of Bits
    2
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Current-Max (A)
    0.3
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    DIP8,.3
  • Output Current Flow Direction
    SINK
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Output Peak Current Limit-Nom (A)
    0.5
  • Screening Level / Reference Standard
    MIL-STD-883 Class B

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5962-8871502PA
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5962-8871502PA