5962-8685923YA by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 5962-8685923YA

Lifecycle status
Transferred
Description
CDIP 27.00x7.62x2.90 mm 2.54mm Pitch
Category
Semiconductors Memory ICs SRAMs OTHER SRAM

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
7.62
Length (mm)
27.555
JESD-30 Code
R-CDIP-T22
Memory Width
4
Package Code
DIP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
OTHER SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
16KX4
Number of Functions
1
Number of Terminals
22
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
35
Number of Words Code
16K
Memory Density (bits)
65536
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Seated Height-Max (mm)
5.08
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
16384
Standby Current-Max (A)
0.001
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
115
Package Equivalence Code
DIP22,.3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883