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5962-8680504QX

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) 5962-8680504QX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    52.455
  • JESD-30 Code
    R-GDIP-T40
  • Memory Width
    16
  • Package Code
    WDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, WINDOW Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    UVPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    64KX16
  • Number of Functions
    1
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    170
  • Number of Words Code
    64K
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Seated Height-Max (mm)
    5.72
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    65536
  • Supply Current-Max (mA)
    60
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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5962-8680504QX
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5962-8680504QX