ProductsManufacturers
Events
Send an RFQBOM Tool

5962-0824503HXX

MICROSS COMPONENTS

MICROSS COMPONENTS 5962-0824503HXX
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Width (mm)
    22.355
  • Length (mm)
    22.355
  • JESD-30 Code
    S-CQFP-G68
  • Memory Width
    32
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    2MX32
  • Number of Functions
    1
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    90
  • Number of Words Code
    2M
  • Memory Density (bits)
    67108864
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.56
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Programming Voltage (V)
    3.3
  • Supply Current-Max (mA)
    200
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883

0 suppliers available to buy or to bid for 5962-0824503HXX

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
5962-0824503HXX
Send an RFQ
5962-0824503HXX