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5962-01-303-3553

Texas Instruments Incorporated

5962-01-303-3553 Datasheet
Texas Instruments Incorporated 5962-01-303-3553
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    MOS
  • JESD-30 Code
    R-XDIP-T18
  • Memory Width
    4
  • Organization
    64KX4
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144 bit
  • Memory IC Type
    PAGE MODE DRAM
  • Refresh Cycles
    256
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    150 ns
  • Number of Words
    65536 words
  • Screening Level
    38535Q/M;38534H;883B
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Terminals
    18
  • Number of Words Code
    64K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max
    110 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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5962-01-303-3553
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5962-01-303-3553