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5962-01-166-3013

Texas Instruments Incorporated

5962-01-166-3013 Datasheet
Texas Instruments Incorporated 5962-01-166-3013
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.20
  • SB Code
    8542.31.00.20
  • Bit Size
    16
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T64
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP64,.9
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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5962-01-166-3013