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573100D00010

BOYD CORP

BOYD CORP 573100D00010
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8541.90.00.00
  • SB Code
    8541.90.00.00
  • Finish
    TIN
  • Profile
    U
  • Width (mm)
    8
  • Height (mm)
    10.16
  • Length (mm)
    22.86
  • Construction
    FIN
  • Body Material
    COPPER
  • Device Used On
    IC
  • Packing Method
    TR,13 INCH
  • Fin Orientation
    FOLDEDBACK
  • Additional Feature
    LOW PROFILE
  • Thermal Support Device Type
    HEAT SINK

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573100D00010
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573100D00010