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54AC708DM

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP 54AC708DM
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T28
  • Memory Width
    9
  • Organization
    64X9
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Number of Words
    64 words
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    150 mA
  • Number of Terminals
    28
  • Standby Current-Max
    0.01 Amp
  • Number of Words Code
    64
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel

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54AC708DM
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54AC708DM