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53S3281BL883B

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) 53S3281BL883B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    11.43 mm
  • Length
    11.43 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-CQCC-N28
  • Memory Width
    8
  • Organization
    4KX8
  • Package Code
    QCCN
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    32768 bit
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    40 ns
  • Number of Words
    4096 words
  • Parallel/Serial
    PARALLEL
  • Screening Level
    MIL-STD-883 Class B
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Seated Height-Max
    2.54 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    28
  • Number of Words Code
    4K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    LCC28,.45SQ
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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53S3281BL883B
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53S3281BL883B