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53RS881J883B

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) 53RS881J883B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T24
  • Memory Width
    8
  • Organization
    1KX8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    8192 bit
  • Memory IC Type
    OTP ROM
  • Number of Words
    1024 words
  • Screening Level
    38535Q/M;38534H;883B
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    24
  • Number of Words Code
    1K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP24(UNSPEC)
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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53RS881J883B
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53RS881J883B