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529/BDA

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS 529/BDA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BIPOLAR
  • JESD-30 Code
    R-XDFP-F14
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Amplifier Type
    COMPARATOR
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    14
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC
  • Response Time-Nom (ns)
    12
  • Package Equivalence Code
    FL14,.3
  • Input Offset Voltage-Max (uV)
    6000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Bias Current-Max (IIB) @25C (uA)
    1.2
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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529/BDA
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529/BDA