ProductsManufacturers
Events
Send an RFQBOM Tool

3DSD1G64VB4402-C

3D PLUS SA

3D PLUS SA 3DSD1G64VB4402-C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    16 mm
  • Length
    26 mm
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B119
  • Memory Width
    64
  • Organization
    16MX64
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    5.4 ns
  • Number of Ports
    1
  • Number of Words
    16777216 words
  • Seated Height-Max
    7.3 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    119
  • Number of Words Code
    16M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

0 suppliers available to buy or to bid for 3DSD1G64VB4402-C

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
3DSD1G64VB4402-C
Send an RFQ
3DSD1G64VB4402-C