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3DPO64M08VS2299MSR00

3D PLUS SA

3D PLUS SA 3DPO64M08VS2299MSR00
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    10.95 mm
  • Length
    20 mm
  • Technology
    CMOS
  • Total Dose
    50k Rad(Si) V
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    8
  • Organization
    8MX8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    67108864 bit
  • Memory IC Type
    OTP ROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Words
    8388608 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    6.25 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    44
  • Number of Words Code
    8M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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3DPO64M08VS2299MSR00