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3DPO64M08VS2299-IBA00

3D PLUS SA

3D PLUS SA 3DPO64M08VS2299-IBA00
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    10.95
  • Length (mm)
    20
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    OTP ROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Position
    DUAL
  • Memory Organization
    8MX8
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    6.25
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    3.3
  • Standby Current-Max (A)
    0.004
  • Supply Current-Max (mA)
    400
  • Package Equivalence Code
    SOP44,.5,32
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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3DPO64M08VS2299-IBA00