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3DFO2G08VS4215ISY-11

3D PLUS SA

3D PLUS SA 3DFO2G08VS4215ISY-11
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    14.7 mm
  • Length
    19.6 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G60
  • Memory Width
    8
  • Organization
    256MX8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    2147483648 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Words
    268435456 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    7.8 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    60
  • Programming Voltage
    3 V
  • Number of Words Code
    256M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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3DFO2G08VS4215ISY-11