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3DFN32G08VS8633-MS-A25

3D PLUS SA

3D PLUS SA 3DFN32G08VS8633-MS-A25
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • Memory Width
    8
  • Surface Mount
    YES
  • Memory IC Type
    FLASH MODULE
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    2K
  • Temperature Grade
    MILITARY
  • Memory Organization
    4GX8
  • Number of Terminals
    50
  • Sector Size (words)
    128K
  • Access Time-Max (ns)
    25
  • Number of Words Code
    4G
  • Memory Density (bits)
    34359738368
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    32K
  • Number of Words (words)
    4294967296
  • Standby Current-Max (A)
    0.0004
  • Supply Current-Max (mA)
    37
  • Package Equivalence Code
    SSOP50,.8,20
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535V;38534K;883S

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3DFN32G08VS8633-MS-A25