3D3D8G16WB2392CN-H9
3D PLUS SA
- Lifecycle statusContact Mfr
- DescriptionDDR3 DRAM, 512MX16, CMOS, PBGA96
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.36
- SB Code8542.32.00.23
- Width10.7 mm
- TechnologyCMOS
- Access ModeMULTI BANK PAGE BURST
- JESD-30 CodeR-PBGA-B96
- Memory Width16
- Organization512MX16
- Package CodeFBGA
- Self RefreshYES
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density8589934592 bit
- Memory IC TypeDDR3 DRAM
- Operating ModeSYNCHRONOUS
- Terminal Pitch0.8 mm
- Number of Ports1
- Number of Words536870912 words
- Seated Height-Max3.4 mm
- Terminal PositionBOTTOM
- Additional FeatureSELF REFRESH
- Number of Functions1
- Number of Terminals96
- Number of Words Code512M
- Package Body MaterialPLASTIC/EPOXY
- Supply Voltage-Max (Vsup)1.575 V
- Supply Voltage-Min (Vsup)1.425 V
- Supply Voltage-Nom (Vsup)1.5 V
0 suppliers available to buy or to bid for 3D3D8G16WB2392CN-H9
Send an RFQ
Send an RFQ Your RFQ will be directly sent to our expert: Pari
Send an RFQ
3D3D8G16WB2392CN-H9
Send an RFQ
3D3D8G16WB2392CN-H9