3D3D8G08WB2335-IS-H9
3D PLUS SA
- Lifecycle statusContact Mfr
- DescriptionDDR3 DRAM, 1GX8, 0.255ns, CMOS, PBGA78
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.36
- SB Code8542.32.00.23
- I/O TypeCOMMON
- TechnologyCMOS
- JESD-30 CodeR-PBGA-B78
- Memory Width8
- Organization1GX8
- Package CodeFBGA
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density8589934592 bit
- Memory IC TypeDDR3 DRAM
- Refresh Cycles8192
- Terminal Pitch0.8 mm
- Access Time-Max0.255 ns
- Number of Words1073741824 words
- Screening LevelESCC9000
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Supply Current-Max192 mA
- Number of Terminals78
- Standby Current-Max0.044 Amp
- Number of Words Code1G
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Output Characteristics3-STATE
- Sequential Burst Length8
- Interleaved Burst Length8
- Package Equivalence CodeBGA78,9X13,32
- Operating Temperature-Max95 Cel
- Operating Temperature-Min-40 Cel
- Supply Voltage-Nom (Vsup)1.5 V
- Clock Frequency-Max (fCLK)667 MHz
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3D3D8G08WB2335-IS-H9