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3D2D8G72UB3369-M-6E

3D PLUS SA

3D PLUS SA 3D2D8G72UB3369-M-6E
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B208
  • Memory Width
    72
  • Organization
    128MX72
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    9437184 bit
  • Memory IC Type
    DDR DRAM MODULE
  • Refresh Cycles
    8192
  • Terminal Pitch
    1 mm
  • Access Time-Max
    0.45 ns
  • Number of Words
    134217728 words
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    500 mA
  • Number of Terminals
    208
  • Standby Current-Max
    0.06 Amp
  • Number of Words Code
    128M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA208,11X19,40
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    333 MHz

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3D2D8G72UB3369-M-6E