Name: 375424B00034G by BOYD CORP
Brand: BOYD CORP
SKU: 375424B00034G-4003063562
Availability: InStock

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5C/W Black Anodized
Category
Miscellaneous Thermal Support Devices Heat Sinks HEAT SINK

Includes: Authorised distributor • 3 year warranty •

Supply Attributes — the amount of time between an order placement and the shipment of the order — refers to the packaging that can be expected for the offer — indicates how the components were made — indicates the category of vendor for the given offer — Date code is used to determine when a product was manufactured.The first two digits indicate the year while the 3rd and 4th digits indicate the week of manufacture. The date code can be found printed on the product label.	Supplier Availability	Price	Quantity
Date Code Within 2 years Packaging Bulk Pack Condition Unknown Supplier Type Authorised distributor	Stock 11,379 Delivery Date AUG 3, 2026 You may change the delivery date during check out. This availability will be shipped by Sourceability. All orders will be shipped from their USA warehouse except those with a country of origin of China. These orders will ship from Singapore and require your courier account number.	232+ $ 1.49144 6,720+ $ 0.95808 10,080+ $ 0.93541	Quantity Increments of 1 Total: — Share this offer

375424B00034G

BOYD CORP