375024B60024G
BOYD CORP
- Lifecycle statusActive
- RoHSRoHS compliant
- DescriptionHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 12.2°C/W Black Anodized
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- ColorBLACK
- FinishANODIZED
- ProfilePIN FIN ARRAY
- Width (mm)40
- Height (mm)18
- Length (mm)40
- ConstructionCLIP
- Body MaterialALUMINUM
- Fin OrientationOMNIDIRECT
- Thermal Support Device TypeHEAT SINK
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375024B60024G
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375024B60024G