374624B60024G
BOYD CORP
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionBOYD - 374624B60024G - Heat Sink, For Ball Grid Array, 23.4 °C/W, BGA, 35 mm, 10.01 mm, 35 mm
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- ColorBLACK
- FinishANODIZED
- ProfilePIN FIN ARRAY
- Width (mm)35
- Height (mm)10
- Length (mm)35
- ConstructionFIN
- Body MaterialALUMINUM
- Fin OrientationOMNIDIRECT
- Thermal Support Device TypeHEAT SINK
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374624B60024G
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374624B60024G