371824B00000G
BOYD CORP
- Lifecycle statusActive
- RoHSRoHS compliant
- DescriptionHeat Sink Passive BGA/FPGA Pin Array Adhesive Black Anodized
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- ColorBLACK
- FinishANODIZED
- ProfilePIN FIN ARRAY
- Width (mm)35
- Height (mm)7
- Length (mm)35
- ConstructionFIN
- Fin OrientationOMNIDIRECT
- Thermal Support Device TypeHEAT SINK
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371824B00000G