364424B00032G
BOYD CORP
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- ColorBLACK
- FinishANODIZED
- ProfilePIN FIN ARRAY
- Width (mm)40.1
- Height (mm)11.4
- Length (mm)40
- ConstructionFIN
- Body MaterialALUMINUM
- Fin OrientationOMNIDIRECT
- Thermal Support Device TypeHEAT SINK
0 suppliers available to buy or to bid for 364424B00032G
Send an RFQ
Send an RFQ Your RFQ will be directly sent to our expert: Pari
Send an RFQ
364424B00032G
Send an RFQ
364424B00032G