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29FCT520CTEB

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 29FCT520CTEB
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    9.144
  • Length (mm)
    16.256
  • JESD-30 Code
    R-GDFP-F24
  • Package Code
    DFP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    1.27
  • Output Data Bus Width
    8
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Seated Height-Max (mm)
    2.286
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Package Equivalence Code
    FL24,.4
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, PIPELINE REGISTER
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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29FCT520CTEB
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29FCT520CTEB