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29F32G08RPFI

MAXWELL TECHNOLOGIES, INC.

MAXWELL TECHNOLOGIES, INC. 29F32G08RPFI
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Technology
    CMOS
  • Width (mm)
    20.828
  • Length (mm)
    25.4
  • JESD-30 Code
    R-CDFP-F68
  • Memory Width
    8
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    4GX8
  • Number of Functions
    1
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    0.635
  • Number of Words Code
    4G
  • Memory Density (bits)
    34359738368
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    7.0866
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    4294967296
  • Programming Voltage (V)
    3.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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29F32G08RPFI