2227MC-08-03-18-F1 by MULTICOMP PRO | Sourcengine

MULTICOMP PRO 2227MC-08-03-18-F1

Lifecycle status
Active
RoHS
RoHS compliant
Description
IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
Category
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
Mounting Style
STRAIGHT
Housing Material
POLYBUTYLENE TEREPHTHALATE
Termination Type
SOLDER
Additional Feature
STANDARD: UL 94V-0
Body Length (inch)
0.4
Current Rating (A)
3
Device Socket Type
IC SOCKET
Number of Contacts
8
Body Breadth (inch)
0.4
Device Type Used On
DIP8
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Configuration
RECTANGLE
Socket Body Depth (inch)
0.165
Insulation Resistance (ohm)
1000000000
Mating Contact Pitch (inch)
0.1
PCB Contact Row Spacing (mm)
7.62
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-25
Dielectric Withstanding Voltage (V)
1000VAC