- Lifecycle statusActive
- RoHSRoHS compliant
- DescriptionHeat Sink Passive BGA/TSSOP/QFN Straight SMD Aluminum 80°C/W
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- Weight (g)0.6
- Width (mm)6.75
- Height (mm)10
- Length (mm)6.75
- ConstructionEXTRUDED
- Body MaterialALUMINUM ALLOY
- Device Used OnIC
- Fin OrientationLONGITUDINAL
- Thermal Resistance (ohm)80
- Thermal Support Device TypeHEAT SINK
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1493